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Industrial Research And Consultancy Centre

Unlocking High-Frequency Surface Acoustic Waves in Silicon: A New Frontier for Phononic and Quantum Devices

Surface acoustic waves (SAWs) −tiny elastic vibrations that travel along the surface of a solid−are the unsung heroes of modern wireless technology, powering the radio-frequency filters in every smartphone. As wireless communication advances towards 5G, 6G, and millimeter-wave (mm-wave) technologies, there is growing demand for compact, low-loss, and ultra-high-speed signal-processing devices compatible with existing silicon electronics.

New Study Reveals How Ultrasonic Vibration Solves Microhole Drilling Problem in Brittle Materials Like Glass

Researchers at IIT Bombay analysed the electrolyte flow and debris removal dynamics to demonstrate how Ultrasonic-Assisted Electrochemical Discharge Machining (UA-ECDM) can overcome the deep debris problem in microhole drilling for improved fabrication in brittle materials.