The invention is a synthetic jet actuator designed to enhance the cooling efficiency of semiconductor modules. It uses a compact, single-cavity design with multiple orifices to generate synthetic jets that effectively cool electronic devices, reducing power consumption and overall module size.
Figure 1. It shows a multiple-orifices synthetic-jet (created by movement of a diaphragm in a cavity). The jet is directed towards a hot surface (requiring cooling). The jet is created by the surrounding air, removing the need for plumbing and reducing the requirement of input power. The use of multiple- jets, in a specially designed configuration, increases the heat transfer while reducing the distance substantially.
As electronic devices become smaller and more powerful, they generate more heat, which needs to be dissipated efficiently to prevent failure. Traditional cooling systems are complex, involving extensive piping and mechanical apparatuses, leading to high costs and power consumption. Existing synthetic jet actuators with single orifices are limited in cooling efficiency and require significant axial distance from electronic devices.
- Enhanced cooling efficiency: The innovative design uses multiple jets from a single cavity, thereby improving cooling over a large area by (i) encompassing a housing with a single cavity and a diaphragm at one end, and (ii) including multiple orifices - central and satellite orifices, or pairs of diametrically opposite orifices, spaced at specific radii to enhance jet formation.
- Low power consumption: It utilizes a single diaphragm and displacer (Axial Displacement - diaphragm displacement to generate synthetic jets) to reduce energy use.
- Compact and simple construction: It is easy to integrate into small, modern electronic devices by designing “the compact structure” in such a way so as to fit closely within semiconductor modules, reducing required axial distance.
- Economical: It reduces costs associated with complex cooling systems.
Currently the prototype has been developed – a housing with a cavity, a diaphragm, and multiple orifices (central and satellite or diametrically opposite pairs). It was tested with different configurations and demonstrated significant improvement in cooling efficiency and power reduction.
Currently the prototype has been developed and was tested with different configurations and demonstrated significant improvement in cooling efficiency and power reduction. It was successful in decreasing the axial distance between the diaphragm and the surface by 5 times.
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The innovation reduces power consumption in cooling systems, contributing to lower energy usage. Also, it leads to cost savings owing to lower manufacturing and operational costs for semiconductor modules.
- Electronics cooling: Improves cooling for components like CPUs in computers, helping prevent overheating and maintain performance
- Consumer electronics: Extends the life and performance of smartphones, tablets, and wearables by preventing them from overheating
- Medical equipment: Provides reliable cooling solutions for medical devices, ensuring they operate safely under stringent thermal conditions
- Computing and servers
- Automotive industry
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