An inpack semiconductor module and a method of manufacturing the same. The module comprises a  thin semiconductor substrate  formed with atleast one electronic device  at one surface thereof and a fluidics network  at the opposite surface thereof separated from the electronic device.  The fluidics network comprises a network of crisscross microchannels  formed transversely along the semiconductor substrate with the microchannels interconnected to one another. The  fluidics network further comprises a coolant inlet reservoir connected to the microchannels at one end thereof and a coolant  outlet reservoir connected to the microchannels at the other end thereof.   A mechanically strong transparent material cover is bonded onto the substrate at the said opposite surface thereof over the fluidics network with an insulating adhesive layer . The cover has formed therein an inlet hole   connected to the inlet reservoir and an outlet hole   connected to the outlet reservoir. The method comprises fabricating the atleast one electronic device at one surface of the semiconductor substrate in a known manner; fabricating the fluidics network at the opposite surface of the semiconductor substrate  separated from the electronic device by selective etching in a known manner; forming the insulating  adhesive coating selectively at the opposite surface of the semiconductor substrate over the  microchannels and bonding the mechanically strong transparent material cover over the  microchannels at the  opposite surface of the semiconductor substrate in a known manner. The cover is formed with the inlet hole connected to the inlet reservoir and  outlet hole connected to the outlet reservoir in a known manner.