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Industrial Research And Consultancy Centre
Patent
Thermal Management of Building Using Encapsulated Phase Change Material Based Heat Exchanger
Abstract

This invention relates to a cooling method for building spaces using a heat exchanger that incorporates encapsulated phase change material (PCM). This heat exchanger reduces the thermal load and stabilizes the mean air temperature of the building space. The system involves a container filled with PCM and a tube for circulating a working fluid, which transfers heat to and from the PCM, enabling effective temperature regulation.

Figure: Schematic diagrams of chamber and photo of the actual chamber with a window on the north face

Problem Statement

Traditional cooling systems for buildings often consume significant energy and may not efficiently manage temperature variations throughout the day. There is a need for a more efficient and cost-effective method to reduce thermal load and stabilize indoor temperatures.

Uniqueness of the Solution

The technology has an encapsulated PCM within a container, with a tube passing through the PCM, and an inlet & outlet for circulating a working fluid.

  • The solution exhibits efficient thermal load reduction and temperature stabilization.
  • It uses water's high heat capacity for better cooling compared to air-based systems. 
  • It is cost-effective and energy-efficient, with reduced need for continuous operation. 
  • It can be installed as a false ceiling for radiant cooling.
Prototype Details

A cubical test chamber with dimensions of 710 mm per side and 57 mm wall thickness, featuring a small window, was used to test the system. The chamber included T-Type thermocouples for temperature measurement and a PCM layer of 18.4 mm thickness.

Current Status of Technology

The technology has been developed and tested in a controlled environment using a cubical test chamber. Performance studies have shown promising results in reducing and stabilizing air temperatures.

Technology readiness level

4

Societal Impact

This technology can significantly reduce energy consumption for cooling buildings, leading to lower utility costs and a smaller carbon footprint. It provides a sustainable solution for maintaining comfortable indoor temperatures.

Applications or Domain
  • Heating, Ventilation, and Air Conditioning (HVAC) in residential and commercial buildings
  • Industrial plants and warehouses for temperature regulation to protect sensitive equipment and stored goods from heat damage 
  • Any enclosed spaces requiring efficient cooling and temperature management

Geography of IP

Type of IP

Application Number

201821001477

Filing Date
Grant Number

505895

Grant Date
Assignee(s)
Indian Institute of Technology Bombay
**This IP is owned by IIT Bombay**