The system enables the chemical vapour deposition at low temperatures. Can deposit silicon nitride and amorphous silicon.
Make and Model
Oxford Instruments, Plasmalab 100
Available mode for use
The types of Si and glass substrates allowed are 2",4", 8" small pieces of wafers.
The Following gases are used:
Silane for Si3N4 , a-Si
Nitrogen for Si3N4
Ammonia for Si3N4
Argon for Plasma
CF4/O2 for Plasma clean gas
Load lock chamber vacuum: 10-3 Torr
Process chamber vacuum: 10-6 Torr
Contact Emailanilkg[at] ee[dot] iitb[dot] ac[dot] in
NCPRE Fabrication Lab, 2nd Floor,
Department of Electrical Engineering