All Research Facilities

Chemical vapour deposition system - I

image 1

Chemical vapour deposition system is a cluster tool which is currently configured with three process chambers for sputter deposition of metal thin films in a state of the art, CMOS manufacturing process.

Make and Model

Applied Materials Inc., FEP Centura

Specifications/Features

  • Three chambers include decoupled plasmanitridation (DPN), Polygen (MOCVD) and RTP units

    • Wafer Size: 8”
    • Gases: SiH4 , PH3 , NH3 , B2H6 , N2 , O2 , Ar, NF3
    • Substrate temperature: upto 800oC
    • Doping and intrinsic polySi deposition, and annealing can be done

     

Facility in-charge

Contact Email

saurabh[dot] lodha[at] gmail[dot] com udayan[dot] ganguly[at] gmail[dot] com

Location

Ground Floor, Electrical Engineering Annex Building

Department of Electrical Engineering

(w.e.f. )

Registration Link:

http://www.iitbnf.iitb.ac.in/iitbnf/index.php/infrastructure?layout=edit&id=18