Atomic layer deposition system
Atomic layer deposition system uses reactive chemistry to generate thin films of one atomic layer thickness at a time and has a remote inductively coupled plasma source to allow for low temperature depositions.
Make and Model
Cambridge Nanotech, Fiji 200
Specifications/Features
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Type of deposition: HfO2 , Al2O3 , TiO2 , TiN, AlN
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Type of substrate: Silicon, Germanium
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Temperature for deposition: 100 to 300oC
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Process gas used: Oxygen, Argon, Nitrogen, Ammonia
Facility in-charge
Contact Email
saurabh[dot] lodha[at] gmail[dot] comLocation
Nano Lab, Ground Floor,
Electrical Engineering Annex Building
Department of Electrical Engineering